About the Book
System-level analysis of complex and high-speed electronic designs is critical to solve electromagnetic, electrothermal, and electromechanical simulation challenges and to ensure that the system works under wide-ranging operating conditions.
The electrothermal analysis of ICs and electronic systems is made more complex by interconnected electrical and thermal effects. Increased electrical content logically generates more heat, which affects the system performance of electronic devices. In this book, the author focuses on EM and thermal analysis in the context of data center electronics systems.
With over 30 years in the industry, BR Publishing, Inc. is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.