The Printed Circuit Designer's Guide to: Stackups
The Design within the Design
by Bill Hargin
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About the Book
From material selection and understanding laminate datasheets, to impedance planning, glass weave skew and rigid-flex materials, topic expert Bill Hargin has written a unique book on PCB stackups.
According to the author, “The difference between a high-speed PCB design that can be built, and a design that should be built, depends upon the backbone of the design itself: the stackup. The stackup touches every single high-speed signal and yet has had surprisingly little written about it.”
According to the author, “The difference between a high-speed PCB design that can be built, and a design that should be built, depends upon the backbone of the design itself: the stackup. The stackup touches every single high-speed signal and yet has had surprisingly little written about it.”
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About the Creator
BR Publishing, Inc.
Salem, Oregon
With over 30 years in the industry, BR Publishing, Inc. is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.