This book challenges long-held assumptions about how the electronics industry evaluates PCB via structures. Drawing on decades of experience, Bob Neves distinguishes three often-confused concepts—process survivability, reliability, and robustness—and explains why each requires a different testing strategy. Readers gain a practical understanding of modern test methodologies, including real-time electrical monitoring, the HATS² test system, and single via structure testing that reveals failure mechanisms hidden by conventional techniques.