• Categories
    • Overview
    • Biographies & Memoirs
    • Business & Economics
    • Children’s Books
    • Education
    • Fine Art
    • Fine Art Photography
    • Cookbooks
    • History
    • Literature & Fiction
    • Photography
    • Poetry
    • Religion & Spirituality
    • Sports & Adventure
    • Travel
    • Wedding
    • All Categories
  • Staff Picks
    • Overview
  • Best Sellers
    • Overview
  • Just Published
    • Overview
  • Publish Your Book
    • Overview
    • Photo Books
    • Trade Books
    • Magazines
    • Notebooks
    • Ebooks
  • Sign Up
  • Log In
    • United States
    • Australia
    • Portugal
    • Netherlands
    • Italy
    • United Kingdom
    • France
    • Germany
    • Spain
    • Canada (English)
    • Canada (French)
  • Home
  • Sign Up
  • Log In
    • Biographies & Memoirs
    • Business & Economics
    • Children’s Books
    • Education
    • Fine Art
    • Fine Art Photography
    • Cookbooks
    • History
    • Literature & Fiction
    • Photography
    • Poetry
    • Religion & Spirituality
    • Sports & Adventure
    • Travel
    • Wedding
    All Categories
  • Photo Books
  • Trade Books
  • Magazines
  • Notebooks
  • Ebooks
  • © 2015 - 2025 RPI Print, Inc.
  • Company
  • Work at Blurb
  • Pricing
  • Privacy Policy
  • Cookie Policy
  • Support
  • Sitemap
  • United States
  • Australia
  • Portugal
  • Netherlands
  • Italy
  • United Kingdom
  • France
  • Germany
  • Spain
  • Canada (English)
  • Canada (French)
    View The Printed Circuit Assembler's Guide to: Process Validation by Graham Naisbitt, Gen3Preview
    Bookdetails_assets_facebook_icon Bookdetails_assets_twitter_icon Bookdetails_assets_pinterest_icon Bookdetails_assets_link_icon
    Share a Link
    copy
    Preview

    The Printed Circuit Assembler's Guide to: Process Validation

    by Graham Naisbitt, Gen3

    This is the price your customers see. Edit list price

    Softcover
    Flexible, high-gloss laminated cover
    Quantity:
    About the Book

    Edit

    Given the current trends toward smart infrastructures, industrial internet of things (IIoT), and connected and electric vehicles, electronic circuit boards are deployed into humid and potentially corrosive environments arguably to a greater extent than ever before; hence, they are at greater risk of failures due to electrochemical migration (ECM). Written by Graham Naisbitt of Gen3, this book explores how establishing acceptable electrochemical reliability can be achieved by using both CAF and SIR testing. This is a must-read for those in the industry who are concerned about ECM and want to adopt a better and more rigorous approach to ensuring electrochemical reliability.
    Features & Details

    Edit

    • Primary Category: Reference
    • Project Option: 6×9 in, 15×23 cm
      # of Pages: 60
    • Isbn
      • Softcover: 9781734200539
    • Publish Date: Jan 14, 2020
    • Language English
    See More
    About the Creator
    I-007eBooks
    IPC Publishing Group, Inc.
    Bannockburn, IL

    IPC Publishing Group, Inc. dba I-Connect007, is dedicated to educating and informing the electronics interconnect supply chain community with content worth sharing. I-007eBooks was launched in 2017 with a micro eBook "guide to" series. I-007eBooks.com is the library for our main site, I-Connect007.com.

    Continue reading
    • © 2015 - 2025 RPI Print, Inc.
    • Company
    • Work at Blurb
    • Pricing
    • Privacy Policy
    • Cookie Policy
    • Support
    • Sitemap
    Suas2020crop

    Good Things on
    the Way


    Watch your email for news and exclusive offers.

    Before you go

    Sign up to get 30% off
    your first book.


    Please enter a valid email address

    Get access to exclusive email offers when you join Blurb's creative community.

    By continuing you agree to the Terms & Conditions and the Privacy Policy.